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Chip Condition

Chip Condition is graded on the physical condition of chip. The condition of the chip depends on the quality of manufacturing and the chip’s wear and tear. The Common Chip Grading Methodology (CCGM) provides for a 100 point scale, not dissimilar to coin grading. However, to attempt to reduce judgment variations, scores for individual components are awarded on a 10 point scale. The general rule for grading is that a 10 is perfection, a 0 is scrap, and significant distractions are a 5. All scores are not equal. Lower scores are weighted heavier because of the impact to the visual appeal of the chip.

 

Condition Score
Scale Condition
10 Perfect/Flawless 
9 Flaw not visible on casual inspection
7 Minor Detraction
5 Significant Detraction
2 Major Detraction
0 Scrap

Following the process outlined below, a chip is ultimately assigned a Chip Grade (CG). Terminology for grades is outlined below:

Chip Grades
Mint CG-98+ Mint_Chip
Near Mint CG-90
Excellent  CG-80
Fine  CG-70
Good CG-60
Fair CG-50
Poor CG-25

 

Common Chip Grading Methodology – CCGM

This CCGM was developed to give chip collectors a common terminology to describe the condition of chips. As with any human analysis judgment, opinion, and bias will always cause variability. The CCGM process provides guidance to commonly express the condition of chips. The process has been simplified as much as possible, but still provides weight to those factors that give the strongest impressions of a chip.

The CCGM Process

For the chip, complete the appropriate CCGM grading matrix. For chips that have metal surfaces other than the leads then choose the Metal Surface Matrix, otherwise choose Non-Metal Surface Matrix. Score each of the Component Factors, according to the Condition Grading Guidelines table. Weights are established by the score given:

Score Weight
Score Weight
10 1
9 1
8 2
7 3
6 5
5 7
4 11
3 17
2 25
1 38
0 57

In addition to weight in the table an Impact Weight must be applied. Impact Weight attempts to account for  in the visual and psychological impact of various defects.

Impact Weight
Factor Weight
Coloration 1
Alignment and Centering 1
Manufacturing Defects 2
Edges Sharp and Clear 2
Print Coloration 4
Scuffs/Scraps 4
Chips or Cracks 8
Dents, Cracks, Corrosion 8
Creases, Cracks, Corrosion 8
Print Irregularities 8

Multiply the Score by the  Score Weight and Impact Weight to determine each Weighted Score. Add all of the Weighted Scores to determine the Total Weighted Score. To determine the Chip Grade, divide the Total Weighted Score by the sum of the weights in Weight column.

This matrix is used for ceramic or plastic chips with metal surfaces, such as lids, other than leads.

CCGM Grading Matrix (Metal Surface )

 
Component Factors Score Weight Weighted Score
Ceramic/Plastic Package Surfaces Coloration      
Manufacturing Defects      
Scuffs/Scratches      
Chips or Cracks      
Metal Surfaces Coloration      
Manufacturing Defects      
Scuffs/Scratches      
Dents, Cracks, Corrosion      
Leads Coloration      
Manufacturing Defects      
Scuffs/Scratches      
Creases, Cracks, Corrosion      
Printing Alignment and Centering      
Edges Sharp and Clear      
Print Coloration       
Print Irregularities      
Total Weighted Score  
Chip Grade =Total Weighted Score / Sum of Weights   

Download a spreadsheet to calculate Chip Grades for Metal Surface Chips

 

This matrix is used for ceramic or plastic chips with no metal surfaces other than leads.

CCGM Grading Matrix (Non-Metal Surface )

 
Component Factors Score Weight Weighted Score
Ceramic/Plastic Package Surfaces Coloration      
Manufacturing Defects      
Scuffs/Scratches      
Chips or Cracks      
Leads Coloration      
Manufacturing Defects      
Scuffs/Scratches      
Creases, Cracks, Corrosion      
Printing Alignment and Centering      
Edges Sharp and Clear      
Print Coloration       
Print Irregularities      
Total Weighted Score  
Chip Grade =Total Weighted Score / Sum of Weights   

Download a spreadsheet to calculate Chip Grades for Non-Metal Surface Chips

 

This matrix is used for chips with all metal surfaces.

CCGM Grading Matrix (All Metal Surface )

 
Component Factors Score Weight Weighted Score
Metal Package Surfaces Coloration      
Manufacturing Defects      
Scuffs/Scraps      
Manufacturing Defects      
Chips or Cracks      
Leads Coloration      
Manufacturing Defects      
Scuffs/Scratches      
Creases, Cracks, Corrosion      
Printing Alignment and Centering      
Edges Sharp and Clear      
Print Coloration       
Print Irregularities      
Total Weighted Score  
Chip Grade =Total Weighted Score / Sum of Weights   

Download a spreadsheet to calculate Chip Grades for All Metal Surface Chips

 

Generally the displayed surface of a chip is most important and “dark” side imperfections are graded 1/2 the value of a “display” side flaw.

Condition Grading Guidelines

 
Component Condition

10

 5

0
Ceramic/ Plastic Surfaces Coloration:  the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package Uniform bright Noticeable and distracting discontinuities or blotches Fading,  mottling, blotches cover most of the surface  and are the distracting focus of attention
Manufacturing defects: proper alignment and form None, no casting or machining defects  Noticeable and distracting alignment or deformities Operation of the chip would be questioned
Scuffs/Scraps:  damage caused by contact with  None Noticeable and distracting surface abrasions Scuff/Scraps are the distracting focus of attention
Chips or Cracks:  surface broken and/or missing None Noticeable and distracting surface abrasions Operation of the chip would be questioned
Metal Surfaces Coloration:  the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package Uniform bright Noticeable and distracting discontinuities or blotches Fading,  mottling, blotches cover most of the surface and are the distracting focus of attention
Manufacturing defects: proper alignment and form None, no casting or machining defects  Noticeable and distracting alignment or deformities Operation of the chip would be questioned
Scuffs, Scratches:  buffed areas of a matte finish, thin shallow cuts No Scuffs, minor hairline scratches Noticeable and distracting scuffs and scratches in normal light Scuffs and scratches are the focus of attention
Dents, Chips, Cracks, Corrosion:  surface broken, corrupted and/or missing None Noticeable and distracting surface abrasions Operation of the chip would be questioned
Leads Coloration:  the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package None Noticeable and distracting discontinuities or botches on some leads Blotches over most leads and are the distracting focus of attention
Manufacturing defects: proper alignment and form None, leads have crisp machined edges Noticeable and distracting alignment or deformities Operation of the chip would be questioned
Scuffs, Scratches:  buffed areas of a matte finish, thin shallow cuts None Noticeable and distracting botches on some leads Scuffs and scratches over most leads and are the distracting focus of attention
Creases, Cracks, Corrosion: creases causes by bent leads, leads broken, corrupted and/or missing None, leads are straight and uniform Noticeable and distracting lead abrasions on some leads Lead abrasions on most leads, chip operation questionable
Printing Alignment and Centering Well centered and aligned Noticeable and distracting centering or alignment Extreme centering and alignment error, some printing missing, illegible
Edges Sharp and Clear Clear well defined edges Noticeable and distracting irregular edges or blurring Faded and mottled,  illegible
Print Coloration:  the uniformity of the print color Uniform bright Noticeable and distracting discontinuities Faded and mottled,  illegible
Print Irregularities Characters complete, no damage Noticeable and distracting sections missing Characters mostly missing, illegible